Inventor · Boise, ID, US

Chan H. Yoo

72Patents
7h-index
49Co-inventors
72Inventor score

Filing activity: Feb 10, 1992 → May 20, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US5574770A Method for controlling overload of main processor of distributed switching system with hierarchy structure Electricity 23 Expired
US6934455B2 Waveguides with optical monitoring Physics 14 Expired
US5513257A Method for controlling overload in centralized and distributed operating hybrid switching system Electricity 13 Expired
US6973236B2 Vertical taper waveguide Physics 10 Expired
US11386004B2 Memory device interface and method Electricity 8 Active
US10103038B1 Thrumold post package with reverse build up hybrid additive structure Electricity 7 Active
US5513255A Method for controlling overload of distributed processors of full electronic switching system Electricity 7 Expired
US5241579A Status management method of a signalling service device in an electric switching system Electricity 5 Expired
US10304805B2 Dual sided fan-out package having low warpage across all temperatures Electricity 4 Active
US10872835B1 Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same Electricity 3 Active
US11037910B2 Semiconductor device having laterally offset stacked semiconductor dies Electricity 3 Active
US10770398B2 Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer Electricity 3 Active
US11264332B2 Interposers for microelectronic devices Electricity 2 Active
US11824010B2 Interposers for microelectronic devices Electricity 2 Active
US11416437B2 Memory devices, modules and systems having memory devices with varying physical dimensions, memory formats, and operational capabilities Physics 2 Active
US11868253B2 Memory device interface and method Electricity 2 Active
US10192843B1 Methods of making semiconductor device modules with increased yield Electricity 2 Active
US10153221B1 Face down dual sided chip scale memory package Electricity 2 Active
US11574820B2 Semiconductor devices with flexible reinforcement structure Electricity 2 Active
US10840229B2 Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer Electricity 2 Active
US10325874B2 Device module having a plurality of dies electrically connected by posts Electricity 2 Active
US10586780B2 Semiconductor device modules including a die electrically connected to posts and related methods Electricity 1 Active
US11664291B2 Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same Electricity 1 Active
US11171118B2 Semiconductor assemblies including thermal circuits and methods of manufacturing the same Electricity 1 Active
US11206749B2 Tubular heat spreaders for memory modules and memory modules incorporating the same Physics 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.