Wafer placement and gap control optimization through in situ feedback
US10196741B2 · kind B2 · utility
3Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2014 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Nov 6, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01D5/24
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Apparatus and methods of dimension control and monitoring between a processes fixture and a susceptor, and position determination of wafers are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.