Inventor · Fremont, CA, US

Todd Egan

69Patents
7h-index
112Co-inventors
71Inventor score

Filing activity: Jul 20, 2008 → Dec 22, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US9157730B2 PECVD process Physics 46 Active
US9029242B2 Damage isolation by shaped beam delivery in laser scribing process Electricity 23 Active
US8969177B2 Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film Electricity 11 Active
US8557682B2 Multi-layer mask for substrate dicing by laser and plasma etch Electricity 8 Active
US9458537B2 PECVD process Physics 8 Active
US10886155B2 Optical stack deposition and on-board metrology Physics 8 Active
US9816187B2 PECVD process Physics 7 Active
US9177864B2 Method of coating water soluble mask for laser scribing and plasma etch Electricity 5 Active
US9252057B2 Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application Electricity 5 Active
US9405287B1 Apparatus and method for optical calibration of wafer placement by a robot Physics 4 Active
US8940619B2 Method of diced wafer transportation Electricity 3 Active
US9870935B2 Monitoring system for deposition and method of operation thereof Electricity 3 Active
US10196741B2 Wafer placement and gap control optimization through in situ feedback Physics 3 Active
US8946057B2 Laser and plasma etch wafer dicing using UV-curable adhesive film Electricity 3 Active
US8078304B2 Dual-mode robot systems and methods for electronic device manufacturing Emerging Cross-Sectional Technologies 3 Active
US9048309B2 Uniform masking for wafer dicing using laser and plasma etch Electricity 3 Active
US9620379B2 Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch Performing Operations; Transporting 3 Active
US8452077B2 Method for imaging workpiece surfaces at high robot transfer speeds with correction of motion-induced distortion Physics 3 Active
US10816464B2 Imaging reflectometer Physics 2 Active
US8859397B2 Method of coating water soluble mask for laser scribing and plasma etch Electricity 2 Active
US10281261B2 In-situ metrology method for thickness measurement during PECVD processes Electricity 2 Active
US11856833B2 In-line monitoring of OLED layer thickness and dopant concentration Electricity 2 Active
US11709477B2 Autonomous substrate processing system Physics 2 Active
US10060032B2 PECVD process Physics 2 Active
US7969568B2 Spectrographic metrology of patterned wafers Physics 2 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.