Optical through silicon via

US10197730B1 · kind B1 · utility

Assignee

• GlobalFoundries Inc. · KY

Inventors

• Yves T. Ngu · Butlers Corners, US
• Vibhor Jain · Williston, US
• John J. Ellis-Monaghan · Grand Isle, US
• Sebastian T. Ventrone · South Burlington, US
• Saurabh Sirohi · South Burlington, US

Key dates

• Filing date: Nov 8, 2017
• Grant date: Feb 5, 2019
• Expiry date: Nov 8, 2037

Classification

• Technology area (CPC G): Physics
• CPC primary: G02B2006/12069
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

The present disclosure relates to semiconductor structures and, more particularly, to optical via connections in chip-to-chip transmission in a 3D chip stack structure using an optical via, and methods of manufacture. The structure has a first wafer, including a first waveguide coupled to an optical resonator in the first wafer, and a second wafer, including a second waveguide, located over the first wafer. The structure also includes an optical via extending between the optical resonator of the first wafer and the second waveguide of the second wafer to optically couple the first and second waveguides.