Method for providing a planarizable workpiece support, a workpiece planarization arrangement, and a chuck
US10199255B2 · kind B2 · utility
1Cited by
10References
20Claims
0Family size
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Key dates
| Filing date | Mar 1, 2017 |
| Grant date | Feb 5, 2019 |
| Priority date | — |
| Expiry date | Mar 19, 2037 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T409/30868
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
According to various embodiments, a workpiece planarization arrangement may include: a chuck including at least one portion configured to support one or more workpieces; and a planarization tool configured to planarize the at least one portion of the chuck and to planarize one or more workpieces on the at least one portion of the chuck; wherein the at least one portion of the chuck includes at least one of particles, pores and/or a polymer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.