Automatic deskew using design files or inspection images

US10204416B2 · kind B2 · utility

Assignee

• KLA-TENCOR CORPORATION · US

Inventors

• Arpit Jain · Kota, IN
• Arpit Yati · Lucknow, IN
• Thirupurasundari Jayaraman · Chennai, IN
• Raghavan Konuru · Kurnool, IN
• Raj Kuppa · Santa Clara, US
• Hema Prasad · Chennai, IN
• Saiyashwanth Momula · Ghanpur, IN
• Arun Lobo · Mangalore, IN

Key dates

• Filing date: Sep 7, 2016
• Grant date: Feb 12, 2019
• Expiry date: Oct 17, 2036

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L22/12
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

Deskew for image review, such as SEM review, aligns inspection and review coordinate systems. Deskew can be automated using design files or inspection images. A controller that communicates with a review tool can align a file of the wafer, such as a design file or an inspection image, to an image of the wafer from the review tool; compare alignment sites of the file to alignment sites of the image from the review tool; and generate a deskew transform of coordinates of the alignment sites of the file and coordinates of alignment sites of the image from the review tool. The image of the wafer may not contain defects.