Endpointing for focused ion beam processing
US10204762B2 · kind B2 · utility
4Cited by
34References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 2012 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Sep 16, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
To expose a desired feature, focused ion beam milling of thin slices from a cross section alternate with forming a scanning electron image of each newly exposed cross section. Milling is stopped when automatic analysis of an electron beam image of the newly exposed cross section shows that a pre-determined criterion is met.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.