Method for forming a semiconductor device with implanted chalcogen atoms
US10205011B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 2016 |
| Grant date | Feb 12, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/62
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments relate to a method for forming a semiconductor device. The method includes forming a source region of a field effect transistor structure in a semiconductor substrate. The method further includes forming an oxide layer. The method also includes incorporating atoms of at least one atom type of a group of atom types into at least a part of the source region of the field effect transistor structure after forming the oxide layer. The group of atom types includes chalcogen atoms, silicon atoms and argon atoms.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.