Patent · US Active

Package with interconnections having different melting temperatures

US10211133B2 · kind B2 · utility

5Cited by

1References

3Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Andreas Grassmann · Villach, AT
Juergen Hoegerl · Regensburg, DE
Angela Kessler · Regensburg, DE
Ivan Nikitin · Regensburg, DE

Key dates

Filing date	Nov 13, 2017
Grant date	Feb 19, 2019
Priority date	—
Expiry date	Nov 13, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/181
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package comprising at least one electronic chip, a first heat removal body on which the at least one electronic chip is mounted by a first interconnection, a second heat removal body mounted on or above the at least one electronic chip by a second interconnection, and an encapsulant encapsulating at least part of the at least one electronic chip, part of the first heat removal body and part of the second heat removal body, wherein the first interconnection is configured to have another melting temperature than the second interconnection.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.