Inventor · Regensburg, DE

Angela Kessler

47Patents
7h-index
40Co-inventors
65Inventor score

Filing activity: Feb 9, 2005 → Nov 14, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US7749797B2 Semiconductor device having a sensor chip, and method for producing the same Electricity 22 Expired
US7464603B2 Sensor component with a cavity housing and a sensor chip and method for producing the same Electricity 19 Active
US7462940B2 Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same Electricity 11 Active
US7443019B2 Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same Electricity 8 Active
US10242969B2 Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same Electricity 8 Active
US7705436B2 Semiconductor device with semiconductor chip and method for producing it Electricity 7 Active
US7629660B2 Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof Electricity 7 Active
US7795727B2 Semiconductor module having discrete components and method for producing the same Electricity 6 Active
US7834467B2 Layer between interfaces of different components in semiconductor devices Emerging Cross-Sectional Technologies 5 Active
US8013441B2 Power semiconductor device in lead frame employing connecting element with conductive film Electricity 5 Active
US10211133B2 Package with interconnections having different melting temperatures Electricity 5 Active
US10074590B1 Molded package with chip carrier comprising brazed electrically conductive layers Electricity 5 Active
US8507080B2 Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material Emerging Cross-Sectional Technologies 4 Active
US7880300B2 Semiconductor chip comprising a metal coating structure and associated production method Electricity 3 Active
US10586756B2 Chip carrier configured for delamination-free encapsulation and stable sintering Electricity 3 Active
US8017438B2 Semiconductor module with at least two substrates Electricity 3 Active
US7768107B2 Semiconductor component including semiconductor chip and method for producing the same Electricity 3 Active
US7589403B2 Lead structure for a semiconductor component and method for producing the same Emerging Cross-Sectional Technologies 3 Active
US8178390B2 Semiconductor component and production method Electricity 2 Active
US10062671B2 Circuit board embedding a power semiconductor chip Electricity 2 Active
US12033909B2 Die package and method of manufacturing a die package Electricity 1 Active
US9263425B2 Semiconductor device including multiple semiconductor chips and a laminate Electricity 1 Active
US7645642B2 Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite Electricity 1 Active
US9536816B2 Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure Electricity 1 Active
US7911039B2 Component arrangement comprising a carrier Electricity 1 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.