Microelectromechanical microphone
US10225635B2 · kind B2 · utility
4Cited by
2References
23Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 29, 2016 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Jun 23, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical microphone includes: a substrate; a sensor chip, integrating a microelectromechanical electroacoustic transducer; and a control chip operatively coupled to the sensor chip. In one embodiment, the sensor chip and the control chip are bonded to the substrate, and the sensor chip overlies, or at least partially overlies, the control chip. In another embodiment, the sensor is bonded to the substrate and a barrier is located around at least a portion of the sensor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.