Patent · US Active

Chip embedding package with solderable electric contact

US10229891B2 · kind B2 · utility

0Cited by

9References

22Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Thorsten Scharf · Regensburg, DE
Steffen Jordan · Viehhausen, DE
Wolfgang Schober · Amberg, DE
Thomas Ziegler · Birkenfeld, DE

Key dates

Filing date	Feb 18, 2017
Grant date	Mar 12, 2019
Priority date	—
Expiry date	Feb 18, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13055
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A package comprising an electronic chip, a laminate-type encapsulant at least partially encapsulating the electronic chip, a wiring structure extending from the electronic chip up to a contact pad, and a completely galvanically formed solderable exterior electric contact electrically coupled with the electronic chip by being arranged on the contact pad.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.