Inventor · Regensburg, DE

Thorsten Scharf

46Patents
3h-index
55Co-inventors
66Inventor score

Filing activity: Apr 29, 2005 → Jul 2, 2024

Most-cited inventions

PatentTitleAreaCited byStatus
US8177878B2 Bonding material with exothermically reactive heterostructures Electricity 13 Active
US9773719B2 Semiconductor packages and methods of fabrication thereof Electricity 5 Active
US10903180B2 Device including semiconductor chips and method for producing such device Electricity 3 Active
US9357709B2 Combination of a towing vehicle and an agricultural harvesting machine drawn thereby including a control device for specifying a ground speed of the combination Human Necessities 3 Active
US10062671B2 Circuit board embedding a power semiconductor chip Electricity 2 Active
US10056348B2 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate Electricity 2 Active
US10629575B1 Stacked die semiconductor package with electrical interposer Electricity 2 Active
US9941229B2 Device including semiconductor chips and method for producing such device Electricity 2 Active
US7770744B2 Rope winding system for winding and unwinding steel ropes of cranes Performing Operations; Transporting 2 Expired
US11862600B2 Method of forming a chip package and chip package Electricity 1 Active
US9437516B2 Chip-embedded packages with backside die connection Electricity 1 Active
US9263425B2 Semiconductor device including multiple semiconductor chips and a laminate Electricity 1 Active
US10971457B2 Semiconductor device comprising a composite material clip Electricity 1 Active
US10886186B2 Semiconductor package system Electricity 1 Active
US11600558B2 Plurality of transistor packages with exposed source and drain contacts mounted on a carrier Electricity 1 Active
US11710684B2 Package with separate substrate sections Electricity 0 Active
US11915999B2 Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element Electricity 0 Active
US12027481B2 Device including semiconductor chips and method for producing such device Electricity 0 Active
US9288945B2 Baler Human Necessities 0 Active
US9149004B2 Baler and method for operating a baler Human Necessities 0 Active
US8555780B2 Bale press Human Necessities 0 Active
US11569186B2 Device including semiconductor chips and method for producing such device Electricity 0 Active
US12211824B2 Power semiconductor package having first and second lead frames Electricity 0 Active
US10964628B2 Clip frame assembly, semiconductor package having a lead frame and a clip frame, and method of manufacture Electricity 0 Active
US11309277B2 Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.