Structures for packaging stress-sensitive micro-electro-mechanical system stacked onto electronic circuit chip

US10233074B2 · kind B2 · utility

Assignee

• TEXAS INSTRUMENTS INCORPORATED · US

Inventors

• Kurt Peter Wachtler · Richardson, US
• Makoto Yoshino · Tokyo, JP
• Ayumu Kuroda · Beppu, JP
• Brian E. Goodlin · Plano, US
• Karen Hildegard Ralston Kirmse · Richardson, US
• Benjamin Stassen Cook · Addison, US
• Genki Yano · Beppu, JP
• Stuart M. Jacobsen · Frisco, US

Key dates

• Filing date: Jan 10, 2018
• Grant date: Mar 19, 2019
• Expiry date: Jan 10, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/73265
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A packaged micro-electro-mechanical system (MEMS) device (100) comprises a circuitry chip (101) attached to the pad (110) of a substrate with leads (111), and a MEMS (150) vertically attached to the chip surface by a layer (140) of low modulus silicone compound. On the chip surface, the MEMS device is surrounded by a polyimide ring (130) with a surface phobic to silicone compounds. A dome-shaped glob (160) of cured low modulus silicone material covers the MEMS and the MEMS terminal bonding wire spans (180); the glob is restricted to the chip surface area inside the polyimide ring and has a surface non-adhesive to epoxy-based molding compounds. A package (190) of polymeric molding compound encapsulates the vertical assembly of the glob embedding the MEMS, the circuitry chip, and portions of the substrate; the molding compound is non-adhering to the glob surface yet adhering to all other surfaces.