Semiconductor device including vertically integrated groups of semiconductor packages
US10236276B2 · kind B2 · utility
3Cited by
9References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2017 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jun 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19105
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device is disclosed including at least first and second vertically stacked and interconnected groups of semiconductor packages. The first and second groups of semiconductor packages may differ from each other in the number of packages and functionality.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.