Yangming Liu
9Patents
3h-index
18Co-inventors
46Inventor score
Filing activity: Jun 12, 2017 → May 20, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10854573B2 | Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch | Electricity | 9 | Active |
| US10236276B2 | Semiconductor device including vertically integrated groups of semiconductor packages | Electricity | 3 | Active |
| US11393735B2 | Semiconductor device including reinforced corner supports | Electricity | 3 | Active |
| US11177239B2 | Semiconductor device including control switches to reduce pin capacitance | Electricity | 1 | Active |
| US11177242B2 | Semiconductor device including magnetic hold-down layer | Electricity | 0 | Active |
| US11961778B2 | Semiconductor device package having multi-layer molding compound and method | Electricity | 0 | Active |
| US11978713B2 | Flip chip bump with multi-PI opening | Electricity | 0 | Active |
| US11985782B2 | Enclosure fitting for electronic device | Electricity | 0 | Active |
| US12033958B2 | Semiconductor device including a suspended reinforcing layer and method of manufacturing same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.