Substrate support with heater
US10242890B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2011 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Dec 19, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/037
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of substrate supports with a heater are provided herein. In some embodiments, a substrate support may include a first member to distribute heat to a substrate when present above a first surface of the first member; a heater coupled to the first member and having one or more heating zones to provide heat to the first member; a second member disposed beneath the first member; a tubular body disposed between the first and second members, wherein the tubular body forms a gap between the first and second members; and a plurality of substrate support pins disposed a first distance above the first surface of the first member, the plurality of substrate support pins to support a backside surface of a substrate when present on the substrate support.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.