Patent · US Active

Fan-out ball grid array package structure and process for manufacturing the same

US10242940B2 · kind B2 · utility

3Cited by
0References
21Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJul 20, 2017
Grant dateMar 26, 2019
Priority date—
Expiry dateJul 20, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/19105
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.