Inventor

Meng-Jen Wang

62Patents
10h-index
78Co-inventors
81Inventor score

Filing activity: Mar 3, 2003 → Jul 7, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8786098B2 Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same Electricity 36 Active
US7706149B2 Micro-electro-mechanical-system package and method for manufacturing the same Emerging Cross-Sectional Technologies 33 Active
US7625818B2 Method for forming vias in a substrate Electricity 27 Active
US7816265B2 Method for forming vias in a substrate Electricity 24 Active
US7250676B2 Multi-package module with heat spreader Electricity 24 Expired
US7811858B2 Package and the method for making the same, and a stacked package Electricity 23 Active
US8252629B2 Method for making a stackable package Electricity 19 Active
US8310063B2 Semiconductor package structure and manufacturing process thereof Electricity 19 Active
US6833993B2 Multichip package Electricity 16 Expired
US6825567B1 Face-to-face multi-chip flip-chip package Electricity 13 Expired
US7253508B2 Semiconductor package with a flip chip on a solder-resist leadframe Electricity 10 Expired
US7425468B2 Method for making flip chip on leadframe package Electricity 9 Active
US7164202B2 Quad flat flip chip package and leadframe thereof Electricity 8 Expired
US7368806B2 Flip chip package with anti-floating structure Electricity 8 Expired
US7041531B2 Method of fabricating flip chip ball grid array package Electricity 7 Expired
US8072081B2 Microelectromechanical system package Electricity 6 Active
US7067904B2 Flip-chip type quad flat package and leadframe Electricity 6 Expired
US7375435B2 Chip package structure Electricity 5 Expired
US8466553B2 Semiconductor device and semiconductor package having the same Electricity 5 Active
US7573124B2 Semiconductor packaging structure having electromagnetic shielding function and method for manufacturing the same Electricity 5 Active
US10522505B2 Semiconductor device package and method for manufacturing the same Electricity 4 Active
US6856027B2 Multi-chips stacked package Electricity 4 Expired
US10937761B2 Semiconductor device package and method for manufacturing the same Electricity 3 Active
US8415807B2 Semiconductor structure and method for making the same Electricity 3 Active
US10242940B2 Fan-out ball grid array package structure and process for manufacturing the same Electricity 3 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.