Patent · US Active

Semiconductor package comprising a transistor chip module and a driver chip module and a method for fabricating the same

US10242969B2 · kind B2 · utility

8Cited by

9References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Olaf Hohlfeld · Warstein, DE
Juergen Hoegerl · Regensburg, DE
Angela Kessler · Regensburg, DE
Magdalena Hoier · Regensburg, DE

Key dates

Filing date	Nov 12, 2013
Grant date	Mar 26, 2019
Priority date	—
Expiry date	Nov 18, 2033

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A semiconductor package includes a first semiconductor module including a plurality of semiconductor transistor chips and a first encapsulation layer disposed above the semiconductor transistor chips, and a second semiconductor module disposed above the first semiconductor module. The second semiconductor module includes a plurality of semiconductor driver channels and a second encapsulation layer disposed above the semiconductor driver channels. The semiconductor driver channels are configured to drive the semiconductor transistor chips.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.