Sensor chip stack and method of producing a sensor chip stack
US10243017B2 · kind B2 · utility
0Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jun 28, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/45
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The sensor chip stack comprises a sensor substrate of a semiconductor material including a sensor, a chip fastened to the sensor substrate, the chip including an integrated circuit, electric interconnections between the sensor substrate and the chip, electric terminals of the chip, the chip being arranged between the electric terminals and the sensor substrate, and a molding material arranged adjacent to the chip, the electric terminals of the chip being free from the molding material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.