Georg Parteder
8Patents
0h-index
11Co-inventors
31Inventor score
Filing activity: Jun 28, 2017 → Oct 23, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US11367672B2 | Semiconductor device with through-substrate via | Electricity | 0 | Active |
| US12211769B2 | Through-substrate via and method for manufacturing a through-substrate via | Electricity | 0 | Active |
| US11764109B2 | Method of forming a through-substrate via and a semiconductor device comprising a through-substrate via | Electricity | 0 | Active |
| US10243017B2 | Sensor chip stack and method of producing a sensor chip stack | Electricity | 0 | Active |
| US12362230B2 | Method of producing a semiconductor body with a trench, semiconductor body with at least one trench and semiconductor device | Electricity | 0 | Active |
| US11127656B2 | Crack-resistant semiconductor devices | Electricity | 0 | Active |
| US11355386B2 | Method for manufacturing a semiconductor device and semiconductor device | Electricity | 0 | Active |
| US11404352B2 | Semiconductor device with through-substrate via and its method of manufacture | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.