Methods and apparatus for profile and surface preparation of retaining rings utilized in chemical mechanical polishing processes
US10252397B2 · kind B2 · utility
0Cited by
7References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2015 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | May 16, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A retaining ring for a polishing process is disclosed. The retaining ring includes a body comprising an upper portion and a lower portion, and a sacrificial surface disposed on the lower portion, the sacrificial surface comprising a negative tapered surface having a taper height that is about 0.0003 inches to about 0.00015 inches.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.