Patent · US Active

Efficient metal-insulator-metal capacitor fabrication

US10256289B2 · kind B2 · utility

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13References
12Claims
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Key dates

Filing dateNov 7, 2017
Grant dateApr 9, 2019
Priority date
Expiry dateNov 7, 2037

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D1/692

Abstract

Methods of forming capacitors include forming a self-assembled pattern of periodic first and second domains using first and second block copolymer materials over a substrate. The second block copolymer material is etched away. Material from the substrate is etched based on a pattern defined by the first block copolymer material to form cavities in the substrate. A capacitor stack is conformally deposited over the substrate, such that the capacitor stack is formed on horizontal surfaces of the substrate and vertical surfaces of the cavities.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.