Light emitting die (LED) packages and related methods
US10256385B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2011 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Oct 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8585
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
LED packages and related methods are provided. The LED packages can include a submount having a top and bottom surface and a plurality of top electrically conductive elements on the top surface of the submount. An LED can be disposed on one of the top electrically conductive elements. The LED can emit a dominant wavelength generally between approximately 600 nm and approximately 650 nm, and more particularly between approximately 610 nm and approximately 630 nm when an electrical signal is applied to the top electrically conductive elements. A bottom thermally conductive element can be provided on the bottom surface and is not in electrical contact with the top electrically conductive elements. A lens can be disposed over the LED. The LED packages can have improved lumen performances, lower thermal resistances, improved efficiencies, and longer operational lifetimes.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.