Yankun Fu
5Patents
4h-index
18Co-inventors
46Inventor score
Filing activity: Jan 14, 2005 → Jul 20, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9024349B2 | Wafer level phosphor coating method and devices fabricated utilizing method | Electricity | 65 | Active |
| US9159888B2 | Wafer level phosphor coating method and devices fabricated utilizing method | Electricity | 58 | Active |
| US7943952B2 | Method of uniform phosphor chip coating and LED package fabricated using method | Electricity | 52 | Active |
| US7777247B2 | Semiconductor light emitting device mounting substrates including a conductive lead extending therein | Electricity | 5 | Active |
| US10256385B2 | Light emitting die (LED) packages and related methods | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.