Connecting metal foils/wires and components in 3D printed substrates with wire bonding
US10259081B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Feb 7, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A three-dimensional electronic, biological, chemical, thermal management, or electromechanical apparatus and method thereof. One or more layers of a three-dimensional structure are deposited on a substrate. The three-dimensional structure is configured to include one or more internal cavities using, an extrusion-based additive manufacturing system enhanced with a range of secondary embedding processes. The three-dimensional structure includes one or more structural integrated metal objects spanning the one or more of the internal cavities of the three-dimensional structure for enhanced electromagnetic properties and bonded between two or more other metal objects located at the same layer or different layers of the three-dimensional structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.