Inventor · Sunland Park, NM, US

David Espalin

15Patents
4h-index
15Co-inventors
49Inventor score

Filing activity: Jan 4, 2012 → Oct 7, 2019

Most-cited inventions

PatentTitleAreaCited byStatus
US9414501B2 Method for connecting inter-layer conductors and components in 3D structures Emerging Cross-Sectional Technologies 12 Active
US9777380B2 Multi-layered 3D printed laser direct structuring for electrical interconnect and antennas Electricity 8 Active
US10518490B2 Methods and systems for embedding filaments in 3D structures, structural components, and structural electronic, electromagnetic and electromechanical components/devices Emerging Cross-Sectional Technologies 7 Active
US10748867B2 Extrusion-based additive manufacturing system for 3D structural electronic, electromagnetic and electromechanical components/devices Emerging Cross-Sectional Technologies 4 Active
US10913202B2 Structurally integrating metal objects into additive manufactured structures Performing Operations; Transporting 2 Active
US10259081B2 Connecting metal foils/wires and components in 3D printed substrates with wire bonding Electricity 2 Active
US10569464B2 Connecting metal foils/wires at different layers in 3D printed substrates with wire spanning Performing Operations; Transporting 1 Active
US11317515B2 Wire embedding system with a curved delivery path Electricity 1 Active
US10464306B2 Metal objects spanning internal cavities in structures fabricated by additive manufacturing Emerging Cross-Sectional Technologies 1 Active
US10691095B2 In-situ diagnostics and control method and system for material extrusion 3D printing Physics 0 Active
US10582619B2 Apparatus for wire handling and embedding on and within 3D printed parts Electricity 0 Active
US10974499B2 Metal objects spanning internal cavities in structures fabricated by additive manufacturing Emerging Cross-Sectional Technologies 0 Active
US11260475B2 Method and system for powder bed fusion additive manufacturing of crack-free aluminum alloys Emerging Cross-Sectional Technologies 0 Active
US10660214B2 Methods for connecting inter-layer conductors and components in 3D structures Emerging Cross-Sectional Technologies 0 Active
US11203165B2 Methods and apparatus for embedding a wire intermittently Performing Operations; Transporting 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.