System, method and computer program product for systematic and stochastic characterization of pattern defects identified from a semiconductor wafer
US10262408B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 22, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Oct 19, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system, method, and computer program product are provided for systematic and stochastic characterization of pattern defects identified from a fabricated component. In use, a plurality of pattern defects detected from a fabricated component are identified. Additionally, attributes of each of the pattern defects are analyzed, based on predefined criteria. Further, a first set of pattern defects of the plurality of pattern defects are determined, from the analysis, to be systematic pattern defects, and a second set of pattern defects of the plurality of pattern defects are determined, from the analysis, to be stochastic pattern defects. Moreover, a first action is performed for the determined systematic pattern defects and a second action is performed for the determined stochastic pattern defects.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.