Advanced manufacturing insight system for semiconductor application
US10268562B1 · kind B1 · utility
1Cited by
1References
12Claims
0Family size
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Key dates
| Filing date | Mar 24, 2017 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Apr 8, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F11/3452
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Described is a method of reducing multitudes of input data signals to a manageable plurality of input data signals and using the manageable plurality of input data signals to obtain response data that is provided to the semiconductor wafer, packaging, or design facility.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.