Patent · US Active

Method of forming a structure on a substrate

US10269558B2 · kind B2 · utility

406Cited by
1,211References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateDec 22, 2016
Grant dateApr 23, 2019
Priority date—
Expiry dateDec 22, 2036

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L21/02315
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

The invention relates to a method of providing a structure by depositing a layer on a substrate in a reactor. The method comprising:

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.