Patent · US Active

Surface treatment of carbon containing films using organic radicals

US10269574B1 · kind B1 · utility

10Cited by
9References
25Claims
0Family size

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Key dates

Filing dateApr 20, 2018
Grant dateApr 23, 2019
Priority date
Expiry dateApr 20, 2038

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01J2237/332
  • WIPO fieldChemical engineering
  • WIPO sectorChemistry

Abstract

Surface treatment processes for treating a workpiece with organic radicals are provided. In one example implementation, a method for processing a workpiece having a semiconductor material and a carbon containing layer (e.g., photoresist) can include a surface treatment process on the workpiece. The surface treatment process can include generating one or more species in a first chamber (e.g., a plasma chamber). The surface treatment process can include mixing one or more hydrocarbon radicals with the species to create a mixture. The surface treatment process can include exposing the carbon containing layer to the mixture in a second chamber (e.g., a processing chamber).

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.