Surface treatment of carbon containing films using organic radicals
US10269574B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2018 |
| Grant date | Apr 23, 2019 |
| Priority date | — |
| Expiry date | Apr 20, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/332
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Surface treatment processes for treating a workpiece with organic radicals are provided. In one example implementation, a method for processing a workpiece having a semiconductor material and a carbon containing layer (e.g., photoresist) can include a surface treatment process on the workpiece. The surface treatment process can include generating one or more species in a first chamber (e.g., a plasma chamber). The surface treatment process can include mixing one or more hydrocarbon radicals with the species to create a mixture. The surface treatment process can include exposing the carbon containing layer to the mixture in a second chamber (e.g., a processing chamber).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.