Substrate processing system, substrate cleaning method, and recording medium
US10272478B2 · kind B2 · utility
6Cited by
2References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2015 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Sep 10, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6715
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.