Patent · US Active

Micro-electro-mechanical system and manufacturing method thereof

US10273148B2 · kind B2 · utility

0Cited by

1References

19Claims

0Family size

Assignee

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. · TW

Inventors

Chun-Wen Cheng · Hengshan, TW
Jung-Huei Peng · Zhubei City, TW
Chia-Hua Chu · Zhubei City, TW
Nien-Tsung Tsai · Baoshan, TW
Yao-Te Huang · Hsinchu, TW
Li-Min Hung · Longqi, TW
Yu-Chia Liu

Key dates

Filing date	Aug 14, 2015
Grant date	Apr 30, 2019
Priority date	—
Expiry date	Aug 14, 2035

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81B2207/07
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

Some embodiments of the present disclosure provide a microelectromechanical systems (MEMS). The MEMS includes a semiconductive block. The semiconductive block includes a protruding structure. The protruding structure includes a bottom surface. The semiconductive block includes a sensing structure. A semiconductive substrate includes a conductive region. The conductive region includes a first surface under the sensing structure. The first surface is substantially coplanar with the bottom surface. A dielectric region includes a second surface not disposed over the first surface.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.