Li-Min Hung
15Patents
4h-index
15Co-inventors
53Inventor score
Filing activity: Aug 9, 2012 → Feb 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9643838B1 | Semiconductor device and package and manufacturing method thereof | Performing Operations; Transporting | 10 | Active |
| US9352315B2 | Method to produce chemical pattern in micro-fluidic structure | Performing Operations; Transporting | 7 | Active |
| US9656260B2 | Method to produce chemical pattern in micro-fluidic structure | Performing Operations; Transporting | 7 | Active |
| US10486153B2 | Method to produce chemical pattern in micro-fluidic structure | Performing Operations; Transporting | 5 | Active |
| US11298697B2 | Method to produce chemical pattern in micro-fluidic structure | Performing Operations; Transporting | 2 | Active |
| US9264833B2 | Structure and method for integrated microphone | Electricity | 2 | Active |
| US9673169B2 | Method and apparatus for a wafer seal ring | Electricity | 1 | Active |
| US10779100B2 | Method for manufacturing a microphone | Electricity | 1 | Active |
| US9998843B2 | Method for manufacturing a microphone | Electricity | 1 | Active |
| US9269679B2 | Wafer level packaging techniques | Electricity | 1 | Active |
| US12303888B2 | Method to produce chemical pattern in micro-fluidic structure | Performing Operations; Transporting | 0 | Active |
| US11678133B2 | Structure for integrated microphone | Electricity | 0 | Active |
| US10273148B2 | Micro-electro-mechanical system and manufacturing method thereof | Performing Operations; Transporting | 0 | Active |
| US9545691B2 | Method of removing waste of substrate and waste removing device thereof | Chemistry; Metallurgy | 0 | Active |
| US8686571B2 | Bonding layer structure and method for wafer to wafer bonding | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.