Methods of manufacturing a magnetic field sensor
US10276789B2 · kind B2 · utility
3Cited by
55References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 3, 2018 |
| Grant date | Apr 30, 2019 |
| Priority date | — |
| Expiry date | Jan 3, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N59/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor process integrates three bridge circuits, each include magnetoresistive sensors coupled as a Wheatstone bridge on a single chip to sense a magnetic field in three orthogonal directions. The process includes various deposition and etch steps forming the magnetoresistive sensors and a plurality of flux guides on one of the three bridge circuits for transferring a “Z” axis magnetic field onto sensors orientated in the XY plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.