Substrate processing apparatus and substrate processing method
US10281210B2 · kind B2 · utility
3Cited by
2References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2014 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Oct 27, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67115
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
According to one embodiment, a substrate processing apparatus (1) includes a table (4) configured to support a substrate W, a solvent supply unit (8) configured to supply a volatile solvent to a surface of the substrate W on the table (4), and an irradiator (10) configured to emit light to the substrate W, which has been supplied with the volatile solvent, and function as a heater that heats the substrate W such that a gas layer is formed on the surface of the substrate W to make the volatile solvent into a liquid ball. Thus, it is possible to dry the substrate successfully as well as to suppress pattern collapse.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.