Semiconductor wafer comprising a monocrystalline group-IIIA nitride layer
US10283356B2 · kind B2 · utility
4Cited by
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22Claims
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Key dates
| Filing date | Jan 15, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jan 19, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/82
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Problems associated with the mismatch between a silicon substrate and a group-IIIA nitride layer are addressed by employing a silicon substrate processed to have a surface comprising closely spaced tips extending from the surface, depositing a group-IIIB silicide layer on the tips, then depositing a group-IIIB nitride layer, and then depositing a group-IIIA nitride.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.