Batch LED heating and cooling chamber or loadlock
US10283379B2 · kind B2 · utility
1Cited by
8References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2016 |
| Grant date | May 7, 2019 |
| Priority date | — |
| Expiry date | Jun 5, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for heating and cooling a plurality of substrate wafers are provided. LED lamps are positioned against the back sides of a plurality of cold plates. In some embodiments, wafers are supported on a wafer lift which can move all wafers together. In some embodiments, wafers are supported on independent lift pins which can move individual wafers for heating and cooling. Some embodiments of the disclosure provide for decreased time between wafer switching in a processing chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.