Photonic integrated circuit package
US10290619B2 · kind B2 · utility
3Cited by
0References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 2017 |
| Grant date | May 14, 2019 |
| Priority date | — |
| Expiry date | Jan 4, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15323
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods, systems, and apparatus, including a photonic integrated circuit package, including a photonic integrated circuit chip, including an active optical element; an electrode configured to receive an electrical signal; a ground electrode; and a bond contact electrically coupled to the electrode; and an ASIC chip including circuitry configured to provide the electrical signal; and a bond contact that is electrically coupled to the circuitry; an bridge chip bonded to at least a portion of the photonic integrated circuit chip and at least a portion of the ASIC chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.