Method and apparatus for cleaning semiconductor wafer

US10297472B2 · kind B2 · utility

Assignee

• ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

• Hui Wang · Shanghai, CN
• Fuping Chen · Shanghai, CN
• Liangzhi Xie · Shanghai, CN
• Shena Jia · Shanghai, CN
• Xi Wang · Shanghai, CN
• Xiaoyan Zhang · Shanghai, CN

Key dates

• Filing date: Nov 28, 2012
• Grant date: May 21, 2019
• Expiry date: Dec 17, 2034

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L21/67781
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method and apparatus (100) for cleaning semiconductor wafer are provided, combining batch cleaning and single wafer cleaning together. The method includes the following steps: tacking at least two wafers from a cassette in a load port (110) and putting said wafers into a first tank (137) filled with chemical solution; after said wafers have been processed in the first tank (137), taking said wafers out of the first tank (137) and keeping said wafers in wet status; putting said wafers into a second tank (138) filled with liquid; after said wafers have been processed in the second tank (138), taking said wafers out of the second tank (138) and keeping said wafers in wet status; putting one of said wafers on a chuck inside a single wafer cleaning module (150); rotating the chuck while applying chemical solution on said wafer; applying deionized water on said wafer; drying said wafer; taking said wafer out of the single wafer cleaning module (150) and then putting said wafer back to the cassette in the load port (110).