BVA interposer
US10297582B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 25, 2015 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Nov 25, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for making an interposer includes forming a plurality of wire bonds bonded to one or more first surfaces of a first element. A dielectric encapsulation is formed contacting an edge surface of the wire bonds which separates adjacent wire bonds from one another. Further processing comprises removing at least portions of the first element, wherein the interposer has first and second opposite sides separated from one another by at least the encapsulation, and the interposer having first contacts and second contacts at the first and second opposite sides, respectively, for electrical connection with first and second components, respectively, the first contacts being electrically connected with the second contacts through the wire bonds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.