Inventor · Fort Collins, CO, US

Michael Newman

24Patents
6h-index
14Co-inventors
62Inventor score

Filing activity: Jun 28, 2005 → Oct 10, 2018

Most-cited inventions

PatentTitleAreaCited byStatus
US7402515B2 Method of forming through-silicon vias with stress buffer collars and resulting devices Electricity 332 Expired
US9502390B2 BVA interposer Emerging Cross-Sectional Technologies 54 Active
US7592697B2 Microelectronic package and method of cooling same Electricity 48 Active
US7528006B2 Integrated circuit die containing particle-filled through-silicon metal vias with reduced thermal expansion Electricity 12 Expired
US8884427B2 Low CTE interposer without TSV structure Electricity 8 Active
US8981564B2 Metal PVD-free conducting structures Electricity 6 Active
US9312175B2 Surface modified TSV structure and methods thereof Electricity 5 Active
US10297582B2 BVA interposer Emerging Cross-Sectional Technologies 3 Active
US10744320B2 Magnetic field detector for implantable medical devices Human Necessities 2 Active
US9123780B2 Method and structures for heat dissipating interposers Electricity 1 Active
US9237648B2 Carrier-less silicon interposer Emerging Cross-Sectional Technologies 1 Active
US9691693B2 Carrier-less silicon interposer using photo patterned polymer as substrate Electricity 0 Active
US10475733B2 Method and structures for heat dissipating interposers Electricity 0 Active
US9893030B2 Reliable device assembly Emerging Cross-Sectional Technologies 0 Active
US10103094B2 Method and structures for heat dissipating interposers Electricity 0 Active
US10396114B2 Method of fabricating low CTE interposer without TSV structure Electricity 0 Active
US9685401B2 Structures for heat dissipating interposers Electricity 0 Active
US9064933B2 Methods and structure for carrier-less thin wafer handling Electricity 0 Active
US9355905B2 Methods and structure for carrier-less thin wafer handling Electricity 0 Active
US10403510B2 Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate Electricity 0 Active
US9558964B2 Method of fabricating low CTE interposer without TSV structure Electricity 0 Active
US9398700B2 Method of forming a reliable microelectronic assembly Emerging Cross-Sectional Technologies 0 Active
US10181411B2 Method for fabricating a carrier-less silicon interposer Emerging Cross-Sectional Technologies 0 Active
US9379008B2 Metal PVD-free conducting structures Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.