Metal block and bond pad structure
US10297631B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2016 |
| Grant date | May 21, 2019 |
| Priority date | — |
| Expiry date | Sep 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48451
Abstract
In some embodiments, the present disclosure relates to an integrated chip (IC) structure having a conductive blocking structure configured prevent radiation produced by a device within a first die from affecting an image sensing element within a second die. The IC structure has a first IC die with one or more semiconductor devices and a second IC die with an array of image sensing elements. A hybrid bonding interface region is arranged between the first and second IC die. A conductive bonding structure is arranged within the hybrid bonding interface region and is configured to electrically couple the first IC die to the second IC die. A conductive blocking structure is arranged within the hybrid bonding interface region and extends laterally between the one or more semiconductor devices and the array of image sensing elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.