Method and system for diagnosing a semiconductor wafer
US10304178B2 · kind B2 · utility
5Cited by
15References
20Claims
0Family size
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Key dates
| Filing date | Sep 18, 2015 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Aug 16, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for diagnosing semiconductor wafer are provided. A target image is obtained according to graphic data system (GDS) information of a specific layout in the semiconductor wafer, wherein the target image includes a first contour having a first pattern corresponding to the specific layout. Image-based alignment is performed to capture a raw image from the semiconductor wafer according to the first contour. The semiconductor wafer is analyzed by measuring the raw image, so as to provide a diagnostic result.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.