System for integrating preceding steps and subsequent steps
US10304675B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2015 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Nov 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/92244
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor manufacturing system has a series of steps, from manufacturing of a semiconductor on a wafer until packaging, that can be easily linked. A semiconductor chip manufacturing device manufactures a semiconductor chip, and a semiconductor packaging device packages the semiconductor chip by attaching the semiconductor chip to a package substrate which is larger than the wafer. The semiconductor chip manufacturing device includes a PLAD system for loading the wafer into and out of the semiconductor chip manufacturing device through a shuttle which is capable of housing the wafer. The semiconductor packaging device includes a PLAD system capable of loading the package substrate into and out of the semiconductor packaging device through a shuttle which is capable of housing the package substrate. The shuttles have container bodies of a same shape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.