Substrate treating apparatus and substrate treating method
US10304687B2 · kind B2 · utility
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9Claims
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Key dates
| Filing date | Jul 20, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Jul 20, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68764
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate treating apparatus. The substrate treating apparatus includes a spin head configured to support the substrate, a cup surrounding an outer circumference of the spin head, a first ejection member having a first nozzle configured to discharge a first chemical to the substrate located in the spin head, and a second ejection member having a second nozzle configured to discharge a second chemical of the same chemical composition as that of the first chemical to the substrate located in the spin head.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.