Substrate processing system printed-circuit control board assembly with one or more heater layers
US10306776B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 29, 2017 |
| Grant date | May 28, 2019 |
| Priority date | — |
| Expiry date | Nov 29, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09263
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A substrate processing system includes a processing chamber, a pedestal arranged in the processing chamber, and an electrostatic chuck (ESC) arranged on the pedestal. The ESC contains a printed circuit board assembly (PCBA) made up of a plurality of printed circuit board layers to mount circuitry that controls operation of the ESC. One or more of the printed circuit board layers includes a heater layer having one or more metal traces, which may be copper, to cover some or all of a surface of the heater layer sufficiently to provide heat to one or more of the remaining printed circuit board layers, to maintain the circuitry within a predetermined temperature range. The heat may be conducted directly among the various other printed circuit board layers, or may be conducted through vias in various ones of the printed circuit board layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.