Method of measuring, device manufacturing method, metrology apparatus, and lithographic system
US10310389B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 30, 2018 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | Mar 30, 2038 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70616
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
Methods and apparatuses for measuring a plurality of structures formed on a substrate are disclosed. In one arrangement, a method includes obtaining data from a first measurement process. The first measurement process including individually measuring each of the plurality of structures to measure a first property of the structure. A second measurement process is used to measure a second property of each of the plurality of structures. The second measurement process includes illuminating each structure with radiation having a radiation property that is individually selected for that structure using the measured first property for the structure.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.