Apparatus and radiant heating plate for processing wafer-shaped articles
US10312117B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 10, 2016 |
| Grant date | Jun 4, 2019 |
| Priority date | — |
| Expiry date | May 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B3/0047
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus for processing wafer-shaped articles includes a rotary chuck adapted to hold a wafer-shaped article of a predetermined diameter thereon. A radiant heating plate faces a wafer-shaped article when positioned on the rotary chuck. The radiant heating plate includes radiant heating elements, but a central region of the radiant heating plate is free of radiant heating elements. The radiant heating plate further includes at least one refraction element that refracts radiation emitted by the radiant heating elements and passed through the at least one refraction element, toward the central region of the radiant heating plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.